logo
Goede prijs  online

details van de producten

Created with Pixso. Huis Created with Pixso. Producten Created with Pixso.
wetenschappelijk laboratoriummateriaal
Created with Pixso.

High-Precision Wire Saw JSZ1231D 12inch sapphire Wafer Slicing

High-Precision Wire Saw JSZ1231D 12inch sapphire Wafer Slicing

Merknaam: ZMSH
MOQ: 2
Prijs: by case
Verpakking: aangepaste dozen
Betalingsvoorwaarden: T/T
Gedetailleerde informatie
Plaats van herkomst:
China
Levering vermogen:
Per geval
Productbeschrijving
High-Precision Wire Saw JSZ1231D Product Overview The JSZ1231D High-Precision Wire Saw is designed for precision slicing applications in the semiconductor industry. It is suitable for high-efficiency, high-accuracy slicing of semiconductor ingots and other hard and brittle materials. The machine features a high-rigidity integrated structure, high-speed main roller drive system, precise wire tension control, hydraulic workpiece clamping, and a stable control system. It