Glas met doorglasstraal (TGV)

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Glas met doorglasstraal (TGV)

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May 31, 2024

Categorie Verbinding: saffiersubstraat

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Tags:

#saffierwafeltje #siliciumsubstraat #saffiermateriaal

Kort: Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.

Gerelateerde Productkenmerken:

Enables device miniaturization with compact interconnect solutions.
Supports anodic bonding with silicon wafers, eliminating out-gassing issues.
Superior high-frequency characteristics ideal for RF applications.
Precise via pitch tolerance of less than ±20μm per 200mm wafer.
Aanpasbaar voor wafers met een diameter tot 200 mm.
Laser-induced etching ensures crack-free blind and through vias.
High aspect ratios and high-density vias for modern technology demands.
Widely used in high-performance computing, 5G, IoT, and sensor packaging.

FAQ's:

What is Through Glass Via (TGV) technology?

TGV technology is a microfabrication technique for creating vertical electrical connections through glass substrates, essential for advanced electronic packaging and high-density integration.
Wat zijn de toepassingen van TGV in halfgeleiders?

In halfgeleiders wordt TGV-technologie gebruikt voor integratie met een hoge dichtheid, hoge frequentieprestaties en verbeterde thermische en mechanische stabiliteit in toepassingen zoals 5G, IoT en sensorverpakking.
What materials are compatible with TGV technology?

TGV technology is compatible with premium materials such as JGS1, JGS2, sapphire, and Corning glass, making it versatile for various high-performance applications.